With COSMO MANUFACTURING SERVICE, we provide a wide array of semi-conductor manufacturing services from single components of to a complete product. We are highly capable of adhering to the design specifications of our clients and coming up with the desired number of excellent and market leading quantity of semiconductor materials.
Whether your company is just beginning or has already reached worldwide phenomenon, your company can just contact us for contract manufacturing in any combination or all of the following:
1. Wafer Fabrication
Wafer fabrication is composed of a series of repeated sequential processes to produce a complete electrical or photonic circuit. The steps are repeated several hundreds of times depending on the complexity of the desired circuits and connections.
2. Thermal Oxidation
In thermal oxidation, a thin layer of oxide is produced on the surface of a wafer by forcing an oxidizing agent to diffuse at high temperature and made to react with the wafer. This process makes use of thermal oxide as one of the building blocks for simple and complex semiconductor devices alike.
The process of masking or photolithography is used to cover one area of the wafer while another area is being worked on. During this process, a light-sensitive film is applied to the wafer using automatic alignment tools to give the wafer a photographic paper-like appearance.
In etching, the photoresist is removed to develop and bake the wafer. The wafer is then exposed to the chemical solution in a gas discharge or plasma to etch away the uncovered portion of the photoresist. Additional chemicals are then used to remove the photoresist and ensure the correct transfer of the image from the mask to the top layer.
In the process of doping, atoms with one less electron than silicon like boron or an atom with one more electron like phosphorus is incorporated into the exposed area in the etching process to modify the silicon’s electrical characteristics.
6. Dielectric Deposition and Metallization
Dielectric deposition and metallization involves the interconnection of individual semiconductor devices using as many as three layers of metal depositions separated by dielectric layers.
The process of passivation involves depositing a final dielectric layer with electrical probes and wire bonds to protect the circuit from damage and contamination. The film is etched with openings to allow access to the metal’s top layer.
8. Electrical Test
Our process of electrical testing involves an automatic, computer-driven system which provides thorough checks on the functionality of each chip on the wafer. Chips that do not pass the electrical tests are marked for rejection.
Be it an emerging company or a well-established corporation, you can benefit from the electrical tests that we offer. This service can be availed of alone or in combination with other semiconductor manufacturing processes that we offer. You may also enjoy full-service contract manufacturing with us.
The process of semiconductor assembly involves visually inspecting the chips that passed the electrical tests under a microscope and assembling these into a package that provides the contact leads for the chips. The encapsulated materials are retested prior to delivery to ensure its high quality and optimum functionality.
Small and big companies can take advantage of the excellent assembly service we offer. This process can be availed of alone or in combination with other semiconductor manufacturing processes that we offer. You may also enjoy full-service contract manufacturing with us.
We are your trusted contract manufacturing partner!